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FDI - Field Device Integration

Handbook for the unified Device Integration Technology

Michael Braun, Daniel Großmann, Benjamin Danzer, Matthias Riedel und Alexander Kaiser

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Michael Braun, Daniel Großmann, Benjamin Danzer, Matthias Riedel, Alexander Kaiser, FDI - Field Device Integration (2015), VDE Verlag, Berlin, ISBN: 9783800740109

Getrackt seit 05/2018

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Beschreibung / Abstract

With FDI, a technology has been developed that combines the advantages of FDT with those of EDDL in a single solution. FDI takes account of the various tasks over the entire lifecycle for both simple and the most complex devices, including configuration, commissioning, diagnosis and calibration.
In this handbook you will find answers to architecture, functionality, and development of the unified device integration technology:
• General introduction to the world of field devices in automation engineering
• The key features of the technology: FDI package, client/server structure of FDI, FDI information model, and based on examples, principle procedures
• Detailled information to FDI packages, User Interface Plugins (UIP), and Open Packaging
Convention, the packaging mechanism of FDI
• Concrete use cases are presented as a recipe book
• How to use the FDI package IDE for creating FDI packages
• Overview of possible developments
This book is written by authors who are proven experts in the material and provides you with a rapid and informed introduction to the FDI technology.

Leseprobe

Inhaltsverzeichnis

  • FDI - Field Device Integration
  • Preface
  • Foreword
  • The authors
  • Content
  • List of abbreviations
  • 2.6 The FDI client
  • 1 Introduction
  • 1.1 Field devices in the automation system
  • 1.2 Field devices in the lifecycle of the automation system
  • 1.3 History of device integration
  • 1.4 Field Device Integration
  • 2 An overview of FDI
  • 2.1 The FDI specification
  • 2.2 The FDI architecture
  • 2.3 The FDI package
  • 2.4 The FDI server
  • 2.5 The FDI information model
  • 2.7 Interaction between the FDI components
  • 2.8 Life-cycle concept
  • 2.9 Benefits
  • 2.10 Summary
  • 3 FDI package technologies
  • 3.1 FDI package
  • 3.2 Electronic Device Description Language
  • 3.3 User interface plugin
  • 3.4 Open Packaging Convention
  • 3.5 Summary
  • 4 FDI package cookbook
  • 4.1 Guide to EDDL or UIP
  • 4.2 Application scenarios
  • 4.3 Templates for offline engineering
  • 4.4 Image for support in online engineering
  • 4.5 Guided commissioning with an assistant
  • 4.6 Display of measured values during operation
  • 4.7 Valve signature for monitoring
  • 4.8 Device logbook for maintenance
  • 4.9 UIP for device configuration
  • 4.10 UIP for valve diagnosis
  • 4.11 Summary
  • 5 Tools for FDI package development
  • 5.1 Creation process
  • 5.2 FDI development environment
  • 5.3 FDI Package Conformance Test Tool
  • 5.4 Automation in the development process
  • 5.5 Extended RRE settings and FDI Package debugging
  • 5.6 Summary
  • Summary and outlook
  • Appendices and directories
  • Bibliography
  • FDI user requirements [NW11]
  • List of figures
  • Listings
  • List of tables
  • List of key words

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