Table of content

• BEGINN
• Pulse Plating in the Third Millennium
• Past and Future of Pulse Plating: An Introduction
• Foreword of the authors
• List of chapters:
• Content
• 1 An Overview of Pulse Deposition
• 1.1 Introduction
• 1.2 Basic Defi nitions
• 1.3 Practical Electrodeposition Systems
• 1.4 Dynamic Phenomena during Pulsed Deposition or Dissolution
• 2 Thermodynamics
• 2.1 Introduction
• 2.2 Electrochemical Equilibrium at Interfaces
• 2.3 The Origin of Electrochemical Potentials and the Nernst Equation
• 2.4 Standard Electrode Potentials
• 2.5 Standard Electrode Potentials and Speciation of Metal Complexes
• 2.6 The Electrical Double Layer
• 2.7 Departure from Equilibrium
• 2.8 Capacitive Effects in Pulse Plating
• 3 Reaction Kinetics
• 3.1 Introduction
• 3.2 Simple Charge Transfer Kinetics
• 3.3 Charge Transfer Kinetics of Multistep Processes
• 3.4 Reaction Mechanisms
• 3.5 Charge Transfer Kinetics of Alloy Plating
• 3.6 Effect of Additives on Charge Transfer Kinetics
• 3.7 Overall Importance of Kinetics in Pulse Plating
• 4 Nucleation and Morphology
• 4.1 Introduction
• 4.2 Mechanism of the Electrochemical Metal Deposition
• 4.3 Pulse Plating and Deposit Morphology
• 4.4 Additive Effects
• 5 Current Distribution
• 5.1 Introduction
• 5.2 Current Distribution
• 5.3 Qualifi cation of Current Distribution
• 5.4 Quantifi cation of Current Distribution
• 5.5 Current Distribution and Pulse Plating
• 6 Mass Transfer during Pulse Deposition
• 6.1 Introduction
• 6.2 Ionic Transport and the Concentration Depletion Layer
• 6.3 Concentration Depletion during Pulse Current Deposition
• 6.4 Maximum Plating Rate during Pulse Deposition
• 6.5 Pulse Limiting Current using the Dual Diffusion Layer Concept
• 6.6 Experimental Verifi cation of the Pulse Limiting Current
• 6.7 Effect of Mass Transport on Microstructure and Current Effi ciency
• 6.8 Effect of Mass Transport on Alloy Composition
• 6.9 Effect of Mass Transport on Additives
• 6.10 Mass Transport on the Microscale
• 7 Modelling of Pulse Plating
• 7.1 Introduction
• 7.2 Model Equations
• 7.3 Effect of Adsorbed Additives and Intermediates
• 7.4 Approximate Analytical Models
• 8 Pulse Rectifi er Systems
• 8.1 Introduction
• 8.2 The Pulse Power Supplies
• 8.3 Current Waveform
• 8.4 The Pulse Plating Process
• 8.5 Safety Information – Electrical Magnetic Fields
• 8.6 Process Control
• 8.7 Dimensioning a Pulse Reverse Power Supply
• 9 Technical Implementation of PP Processes
• 9.1 Implementation – Guidelines Arising from Theoretical Considerations
• 9.2 Practical Implementation of Pulse Plating
• 10 Energy and Material Considerations
• 10.1 Introduction
• 10.2 Pulse Plating and Energy Consumption
• 10.3 Material
• 10.4 CO2 Emission
• 11 Pulse Plating of Copper on Printed Circuit Boards
• 11.1 Introduction
• 11.2 Summary of early Investigations of Pulse and Pulse Reverse Plating of Copper
• 11.3 Reactions
• 11.4 Throwing Power
• 11.5 Structure and Morphology
• 11.6 Mechanical Properties
• 11.7 Superimposed Pulse Reverse Plating
• 11.8 Recommended Pulse Parameters Settings
• 12 Pulse Plating of Nickel and its Alloys
• 12.1 Introduction
• 12.2 Watts Baths
• 12.3 Sulfamate Baths
• 12.4 Chloride Baths and Woods Strike
• 12.5 Nanocrystalline Nickel Layers
• 12.6 Nickel-Cobalt and Nickel-Cobalt-Iron
• 12.7 Nickel-Iron
• 12.8 Nickel-Copper
• 12.9 Nickel-Tungsten and Nickel-Phosphor
• 12.10 Other Nickel Alloys
• 12.11 Nickel Electroforming
• 13 Pulse Plating of Tin and its Alloys
• 13.1 Introduction
• 13.2 Alkaline Electrolyte Systems
• 13.3 Acidic Electrolyte Systems
• 13.4 Gold-Tin Alloys
• 13.5 Silver-Tin Alloys
• 13.6 Tin-Zinc Alloys
• 13.7 Tin-Lead Alloys
• 13.8 Copper-Tin Alloys
• 13.9 Pulse Plating and Whisker Formation
• 14 Pulse Plating of Chromium
• 14.1 Introduction
• 14.2 Crack Formation and Elimination
• 14.3 Microstructured Chromium Surfaces
• 14.4 Multilayer Chromium Deposits
• 14.5 Practical Considerations and Application
• 14.6 Pulse Deposition using Trivalent Chromium Baths
• 15 Pulse Plating of Precious Metals
• 15.1 Introduction
• 15.2 Gold
• 15.3 Silver
• 15.4 Palladium
• 15.5 Platinum
• 15.6 Rhodium
• 15.7 Precious Metal Alloys
• 16 Pulse Plating of Zinc and its Alloys
• 16.1 Introduction
• 16.2 Pulse Plating of Zinc
• 16.3 Zinc-Nickel Alloys
• 16.4 Other Zinc Alloys
• 16.5 Hydrogen Embrittlement
• 17 Pulse Polishing, Machining and Anodising
• 17.1 Introduction
• 17.2 Theory of Anodic Processes
• 17.3 Pulsed Electropolishing
• 17.4 Pulsed Electrochemical Machining
• 17.5 Pulsed Anodisation
• 18 Pulse Deposition of Nanostructured Metal Multilayers
• 18.1 Introduction
• 18.2 Processing of Compositionally Modulated Materials
• 18.3 Dual Bath Electrodeposition
• 18.4 Single Bath Electrodeposition
• 19 Pulse Plating in Combination with Particle Dispersion
• 19.1 Introduction
• 19.2 Particle Incorporation and Zeta Potential
• 19.3 Nanoscaled Composite Coatings
• 19.4 Nickel Dispersion Coatings
• 19.5 Copper Dispersion Coatings
• 19.6 Gold Dispersion Systems
• 20 References
• 21 Index