LabWorX / Mastering Surface Mount Technology

Straight from the Lab to your Brain / LabWorX 2

Vincent Himpe

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Vincent Himpe, LabWorX / Mastering Surface Mount Technology (30.03.2024), Elektor, Aachen, ISBN: 9781907920127

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Beschreibung / Abstract

Inhaltsverzeichnis

  • Mastering Surface Mount Technology
  • Copyright
  • Foreword
  • 1. Table of contents
  • 2. History
  • 3. Tools
  • 3.1. PARTS MANIPULATION
  • 4. SOLDERING
  • 4.1. SOLDERING IRON OR STATION
  • 4.2. HOT-AIR REWORK STATIONS
  • 4.3. HOT AIR HANDGUNS
  • 4.4. BGA STATION
  • 4.5. REFLOW OVENS
  • 4.6. TEMPERATURE AND POWER
  • 4.7. SOLDERING TIPS
  • 4.8. HEAT GUN NOZZLES
  • 4.9. SOLDER
  • 4.10. SPECIALTY SOLDERS
  • 4.11. SOLDER PASTE
  • 4.12. PASTE APPLICATION
  • 4.13. SOLDER BALLS
  • 4.14. FLUX
  • 4.15. FLUX REMOVER
  • 4.16. ULTRASONIC CLEANER
  • 5. OTHER SOLDERING TOOLS
  • 5.1. FUME EXTRACTOR
  • 5.2. DENTAL PICKS
  • 5.3. XACTO KNIFE
  • 5.4. SOLDER WICK
  • 5.5. APPLICATOR BOTTLES
  • 5.6. SOFT BRUSH
  • 5.7. SOLDERING SPONGE
  • 6. MAGNIFIERS
  • 6.1. POCKET / INSPECTION MAGNIFIER / WEARABLE MAGNIFIERS
  • 6.2. BENCH MAGNIFIERS WITH BUILT IN LIGHT
  • 6.3. STEREO INSPECTION MICROSCOPE
  • 6.4. COMPUTER MICROSCOPE
  • 6.5. VISION SYSTEMS
  • 6.6. SPECIALIZED INSPECTION SYSTEMS
  • 6.7. XRAY SYSTEMS
  • 7. PARTS PLACEMENT
  • 7.1. MANUAL PLACEMENT
  • 7.2. ADVANCED MANUAL AND SEMI MANUAL PLACEMENT SYSTEMS
  • 7.3. AUTOMATIC PLACEMENT
  • 8. PARTS STORAGE
  • 8.1. FACTORY DELIVERED STORAGE
  • 8.2. SMALL VOLUME STORAGE
  • 8.3. BENCHTOP STORAGE
  • 9. ESD AND ESD SAFETY
  • 9.1. WHAT IS %8FSTATIC ELECTRICITY�
  • 9.2. ESD PROTECTION
  • 9.3. THE NECESSITY OF %8FEARTH�
  • 9.4. ESD SAFE WORKSTATION SETUP
  • 9.5. ESD SAFE STORING OF PARTS
  • 9.6. COMMERCIAL SOLUTIONS
  • 9.7. HOMEGROWN SOLUTIONS
  • 9.8. A COUPLE OF WORDS OF CAUTION
  • 10. SETTING UP AN EFFICIENT WORKBENCH
  • 10.1. THE ESSENTIALS
  • 10.2. OTHER THINGS TO KEEP CLOSE AT HAND
  • 10.3. TAMING COMPONENTS
  • 10.4. TAMING THE WORKPIECE
  • 11. CIRCUIT BOARD ASSEMBLIES
  • 11.1. PREMADE FORMS
  • 11.2. ETCHED BOARDS
  • 11.3. SOME BOARD TERMINOLOGY
  • 11.4. DIFFERENT ASSEMBLY TYPES
  • 12. PRINTED CIRCUIT BOARDS
  • 12.1. SOME HISTORY
  • 12.2. PCB MATERIAL
  • 12.3. THE MECHANICAL PROCESS
  • 12.4. THE CHEMICAL PROCESS
  • 12.5. SURFACE PROTECTION
  • 12.6. ELECTRICAL TEST
  • 13. MAKING BOARDS IN THE HOME OR SMALL LAB
  • 13.1. TONER TRANSFER METHOD
  • 13.2. PHOTOGRAPHIC METHOD
  • 13.3. ETCHING
  • 13.4. POST PROCESSING
  • 14. REFLOW SOLDERING
  • 14.1. REFLOW PROFILE
  • 14.2. DEFECTS
  • 15. SOCKETS AND PACKAGE ADAPTERS
  • 15.1. SOCKETS
  • 15.2. PACKAGE ADAPTERS
  • 16. SMD COMPONENTS
  • 16.1. RESISTORS
  • 16.2. CAPACITORS
  • 16.3. CAPACITOR CLASSIFICATION
  • 16.4. ELECTROLYTIC CAPACITORS
  • 16.5. OTHER CAPACITORS
  • 16.6. ESR: EQUIVALENT SERIES RESISTANCE
  • 16.7. ESL: EQUIVALENT SERIES INDUCTANCE
  • 16.8. INDUCTORS
  • 16.8.3. PCB inductors
  • 17. ACTIVE COMPONENTS
  • 17.1. DIODES
  • 17.2. TRANSISTORS
  • 17.3. INTEGRATED CIRCUITS
  • 18. IDENTIFYING PARTS
  • 19. TEST TOOLS
  • 19.1. TEST LEADS
  • 19.2. TWEEZER PROBES
  • 19.3. SCOPE PROBES
  • 19.4. SMART TWEEZERS
  • 19.5. GRABBERS
  • 19.6. TESTCLIPS
  • 19.7. SO, PLCC AND TQFP CONTACTORS
  • 19.8. FOOTPRINT ADAPTERS
  • 19.9. TEST AND ZIF SOCKETS
  • 20. SOLDERING TECHNIQUES
  • 20.1. TECHNIQUES USING A STANDARD SOLDERING IRON
  • 20.2. TECHNIQUES INVOLVING A HOT AIR STATION
  • 20.3. SOLDER PASTE AND STENCIL TECHNIQUES
  • 20.4. PRACTICE MAKES PERFECT
  • PROJECTS
  • 21. PROJECT 1: EARTH BONDING PLUG
  • 22. PROJECT 2: LED TESTER
  • 22.1. SCHEMATIC
  • 22.2. WORKBENCH SETUP
  • 22.3. PREPARING THE PCB
  • 22.4. PLACING THE FIRST PARTS
  • 22.5. PLACING THE PASSIVE COMPONENTS
  • 22.6. DIODES AND LEDS
  • 22.7. FINISHING TOUCHES
  • 22.8. POST PROCESSING CLEAN-UP.
  • 23. PROJECT 3: PWM CONTROLLER FOR LIGHTBULB
  • 23.1. SCHEMATIC
  • 23.2. WORKBENCH SETUP
  • 24. PROJECT 4: RING LIGHT
  • 24.1. ASSEMBLY
  • 24.2. POSITIONING THE STENCIL
  • 24.3. PASTE APPLICATION
  • 24.4. INSPECTING THE SOLDER PASTE DEPOSITION1
  • 24.5. PARTS PLACEMENT
  • 24.6. SOLDERING
  • 24.7. THRU-HOLE PARTS
  • 25. PROJECT 5: UV EXPOSURE TIMER
  • 25.1. THE CONTROLLER
  • 25.2. ASSEMBLY
  • 25.3. CONTROLLER ASSEMBLY
  • 25.4. PLACING PARTS
  • 25.5. INSTALLING THE THROUGH-HOLE PARTS
  • 25.6. PROGRAMMING THE CPU
  • 25.7. FINAL ASSEMBLY AND WRAP-UP
  • 26. PROJECT 6: MAKING YOUR OWN REFLOW OVEN FROM A PIZZA TOASTER
  • 26.1. SCHEMATIC
  • 26.2. CONTROL LOOP
  • 26.3. ASSEMBLY
  • 26.4. FIRMWARE
  • 26.5. OPERATION
  • 26.6. DOWNLOADABLE MATERIAL
  • 27. APPENDIX
  • 28. PROJECT KITS
  • 29. INDEX

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