ETG-Fb. 161: CIPS 2020

11th International Conference on Integrated Power Electronics Systems, Proceedings March, 24 – 26, 2020, Berlin, Germany

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VDE ETG (Hg.), ETG-Fb. 161: CIPS 2020 (2020), VDE Verlag, Berlin, ISBN: 9783800752263

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Beschreibung / Abstract

In the next decades, power electronic system development will be driven by energy saving systems, intelligent energy management, power quality, system miniaturization and high reliability. Monolithic and hybrid system integration will include advanced device concepts including wide bandgap devices, new packaging technologies and the overall integration of actuators/drives (mechatronic integration).

CIPS is consequently focused on the following main aspects:
- assembly and interconnect technology for power electronic devices and converters
- integration of hybrid systems and mechatronic systems with high power density
- systems and components operational behaviour and reliability

Basic technologies for integrated power electronic systems as well as upcoming new im-portant applications will be presented in interdisciplinary invited papers.
In 2020 the successful story of CIPS will continue as the conference focus is today more important than ever - increasing functionality, energy efficiency and system reliability while decreasing cost.

We are pleased to welcome all engineers coming from industry and academia engaged in power electronics-related
- system development
- component development
- reliability engineering
- research

Inhaltsverzeichnis

  • ETG-Fachbericht 161: CIPS 2020
  • Technical Sponsors
  • Imprint
  • Chairmen's Welcome Message
  • Committees
  • Content
  • Keynote
  • Session Power Packages and Modules (1)
  • Session Components to be Integrated (1)
  • Session Power Packages and Modules (2)
  • Session Components to be Integrated (2)
  • Session Power Packages and Modules (3)
  • Session Components to be Integrated (3)
  • Session Power Packages and Modules (4)
  • Session Components to be Integrated (4)
  • Keynote
  • Session Power Packages and Modules/Mechatronic Systems (1)
  • Session General Aspects of Packaging (1)
  • Session Power Packages and Modules/Reliability (2)
  • Session Clean Switching, EMC (1)
  • Poster Session Clean Switching, EMC
  • Poster Session Components to be Integrated
  • Poster Session General Aspects of Packaging
  • Poster Session Mechatronic Systems and their Applications
  • Poster Session Power Packages and Module
  • Poster Session Reliability
  • Session Reliability (1)
  • Session Clean Switching, EMC (2)
  • Keynote
  • Session Reliability (2)
  • Session General Aspects of Packaging (2)
  • Session Reliability (3)
  • Session General Aspects of Packaging (3)
  • Keynote
  • Wide-Bandgap Semiconductor Power Electronics: Overcoming Barriers in Materials to Circuits for a more Electrified Future
  • Evaluation of a GaN HEMT Half-Bridge embedded to a Multilayer Aluminum Nitride Substrate
  • Surface-Mount Package IPM with Highly Reliable Transfer Molding Resin
  • Simple and Precise Calorimetry Method for Evaluation of Losses in Power Electronic Converters
  • Experimental Study of the Coss-Losses Occurring During ZVS Transitions - Emphasis on Low and High Voltage GaN-HEMTs
  • Implementation and validation of a dynamic calorimetric method to evaluate the losses in switching discrete power MOSFETs
  • Is Pressureless Sintering Ready for Power Electronic Modules?
  • Comparison of Silver Sintered Assemblies on Non-DCB Substrates
  • Sintered-copper Die-attach: Processing, Properties, and Reliability
  • Thick film paste systems for multifunctional copper power modules
  • Monolithic Integration of Inductive Components in a GaN-on-Si Technology
  • A 600V GaN-on-Si Power IC with Integrated Gate Driver, Freewheeling Diode, Temperature and Current Sensors and Auxiliary Devices
  • Novel back-end-of-line compatible method for integration of inductances with magnetic core on silicon
  • Ultra-low loss integrated magnetics platform for high frequency power delivery networks
  • Thermal Analysis of Power Module with Double Sided Direct Cooling using Ceramic Heat Sinks
  • Low voltage switching cell for high density and modular 3D power %0Amodule with integrated air-cooling
  • Direct heat sink printing on metallized ceramic substrate for power electronics applications: heat treatment identification and its impacts
  • Dynamic Current Balancing of Parallel Connected IGBT Devices using PCB Sensors for
  • Detecting Three-Phase Power Inverter Output Currents By A Single PCB Current Sensor
  • Three-State Output Gate Driver for IGBTs
  • Optimisation and Application Studies for the M-Shunt Structure applied to Printed Circuit Boards
  • The Opportunities of Integration Technologies for Active and Passive Components
  • System integration and analysis of SiC-based high power inverter with up to 250 kW and switching slopes of up to 50 kV/µs for novel powertrain concepts
  • PCB Embedded dies for low thickness Wireless rotary transformer
  • Integration of Printed Electronics in Potted Power Electronic Modules
  • SiC Power Module with integrated RC-Snubber Design for Voltage Overshoot and Power Loss Reduction
  • Full-SiC Integrated Power Module based on Planar Packaging Technology for High Efficiency Power Converters in Aircraft Applications
  • Multi-chip Medium Voltage SiC MOSFET Power Module with Focus on Low Parasitic Capacitance
  • Ultra-high power density server supplies employing GaN power semiconductors and PCB-integrated Magnetics (Invited)
  • WBG power semiconductor packaging with advanced interconnection technologies (Invited)
  • Improvement of High-temperature Reliability of Power Modules by Multi-step Temperature Bonding Process of Zn-Al Solder
  • SiCmodul - Modular high-temperature SiC power electronics for fail-safe power control in electrical drive engineering
  • End-of-life mechanism due to cyclic thermomechanical loading of power modules with .XT joining technology
  • Power Cycling Reliability and Failure Modes in Power Modules with Novel Emitter Contact and Sintering Technologies
  • Power Cycle Testing at Low Temperature Swings - Evaluating the Stability of SAC- and SnSb-based Chip Solder Layers
  • High Power Density EMI Mitigation in Power Electronics Converters: Active and Integrated Solutions (Invited)
  • Reduction of Common Mode EMI noise in microstrip line based commutation paths designed for sub-nH loop inductance
  • Impact of multilevel converters on EMC filter weight of a 70 kVA power drive system for More Electrical Aircraft
  • Control scheme for EMI reduction via spread spectrum modulation for triangular current mode (TCM) DC/DC converters
  • Analysis of the gate driver stray inductance in a Vienna rectifier through parametric Electromagnetic simulations
  • Investigation of the Current Ripple caused by the Main Inverter in the High Voltage DC Bus of Electric Vehicles
  • Low-Inductance DC-link Design dedicated to SiC-based Highly Integrated Inverters
  • Operating a du/dt Filter with a SiC Halfbridge Module and Integrated Active Snubber
  • Switching speed evaluation of e-mode GaN HEMTs in ultra-low inductive switching cell designs
  • Wideband Macro-Modeling of Power Modules for Transient Electromagnetic Analysis
  • Thin-film Magnetics-on-Silicon Integrated Transformer for Isolated Signal and Power Coupling Applications
  • Digital Gate Drive Control Method for Active Voltage Balancing of Series-connected IGBT Devices
  • Ultra-Compact Combined Common Mode (CM)- and Differential Mode (DM)-Inductors
  • PCB Embedded Toroidal Inductor for 2MHz Point-of-Load Converter
  • Design of Interleaved GaN transistor based Buck Converter with Directly Coupled Foil Winding Inductor
  • Investigation on static and dynamic behavior of integrated current sensor in Automotive IGBT module with SPICE based model
  • Improved Performances of 6,5 kV IGBT Module by using Current Source Gate Driver
  • A General Model Translation Approach for Vertical Power MOSFETs Based on BSIM3 Model
  • Study and Design of an Integrated CMOS Laser Diode Driver for an iToF-based 3D Image Sensor
  • Application of Neural Networks to Accelerate Thermomechanical Simulations of Power Modules for Lifetime Prediction
  • Deformation Measurements during Active Operation of Power Modules with Novel Assembly and Packaging Technology
  • Paste Processing and Structural Properties of Copper Metal-Matrix Composites Containing Short Carbon Fibers
  • Thermal Simulation for Power Density Optimization of SiC-MOSFET Automotive Inverter
  • Experimental Analysis and Modeling of Bond Formation in Ultrasonic Thick Wire Bonding
  • Influence of process and stress conditions on microstructure and failure mechanisms of 2nd level sintered Ag joi
  • Copper wire bonding process characterization and simulation
  • PCB layout tool integrated loss and inductance estimation
  • Design and integration of inductive components for a high-frequency 11 kW / 800 off-board charger for electric vehicles
  • Low-inductive SiC H-Bridge for Direct-Inverter-Single-Tooth-Integration (German BMBF Public Funded Research Project %8FVERSE%8F)
  • High Frequency DC-DC Converter for an Integrated Electrical Excitation of an Axial Flux Machine with Fiber-composite Rotor: A Multidisciplinary Approach
  • Half-bridge Concepts for High Blocking Voltage GaN HEMTs (EU Public Funded Project %8FInRel-NPower%8F)
  • Two-layered planar SiC power module for industrial applications
  • Characterization of the Junction Temperature of SiC Power Devices via Quasi-Threshold Voltage as Temperature Sensitive Electrical Parameter
  • Design, Manufacturing and Evaluation of a Highly Integrated Low-Voltage High-Current Inverter
  • Highly Integrated Switching Cell Design based on Copper Diamond Heat Spreader, 3D Printed Heat Sink and HTCC Logic Board
  • PCB Embedded Transformer for Isolated DC-DC Power Supplies
  • Improved Stress Distribution in Railway Traction Converters Using New High Power Half-Bridge Modules
  • Double pulse vs. indirect measurement: Characterizing switching losses of integrated power modules with wide bandgap semiconductors
  • Electrical characteristics of double-sided cooling SiC power module using Ni micro plating bonding
  • Application considerations for Double Sided Cooled Modules in Automotive Environment
  • Smart Ultrasonic Welding in Power Electronics Packaging
  • A Review on the Application of On-Line Von (On-State Voltage) Sensing for Junction Temperature Estimation of Power Semiconductor Modules
  • Mechanical and microstructural characterization of LTCC and HTCC ceramics for high temperature and harsh environment application
  • Introducing the LEGO Mission Profile Analysis Methodology
  • Microstructure And Shear Strength Correlation After Reliability Testing of Bond Contacts Using Alternative Al Heavy Wire Materials
  • Loop formation effects on the lifetime of wire bonds for power electronics
  • Thermo-mechanical reliability of nanosilver sintered joints for large-area substrate bonding
  • Reliability of Capacitors and Magnetic Components in Power Electronic Applications (Invited)
  • H3TRB Test on 6.5 kV SiC-JBS Diodes
  • A Method for the Characterization of Adhesion Strength Degradation of Thin Films on Si-Substrate under Thermal Cycling Test
  • Survey on Generative and Discriminative Fault Detection Approaches with Focus on SiC Components
  • EMI Imaging System Using a Double-pulse-compose-method for Front-loading of Noise Evaluation
  • Gallium Nitride in Automotive High-Speed Drive Applications
  • Power cycling methods, measurement accuracy, comparability
  • Comparative study of determining junction temperature of SiC MOSFETs during power cycling tests by a Tj sensor and the VSD(T)-method
  • Power Cycling of SiC MOSFET Single-Chip Modules with Additional Measurement Cycles for Life End Determination
  • Impact of load-pulse duration on power-cycling capability of SiC devices
  • PCB Embedding using Single-Switch-Pre-Packages as Modular Building Blocks
  • Generic thermal cooling design for multicell converters
  • Electromagnetic switching cell design and characterization for WBG power semiconductors
  • IGBT current filamentation observation by segmented collector sensing under UIS condition
  • Simultaneous Imaging of Strain and Temperature using Single IR Camera
  • Power cycling close to 50 Hz load, low temperature swings combined with an adjustable part of switching losses
  • Dynamic AC Power Cycling with Coupled Inverters Operating Under Application-Oriented Conditions
  • Development of sinter paste with surface modified copper alloy particles for die-attach bonding
  • Application of response surface methodology for optimization of Ag-Ag Direct Bonding for Wafer-Level Power Electronics Packaging
  • A New Development of Micro-Copper Sinter Material for High Power Electronics Application
  • Numerical material design for reliable power electronics with cementbased encapsulation
  • Present and Future of Fault Tolerant Drives Applied to Transport Applications
  • Your opinion matters!

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